February 7, 2014
The information has been disseminated by the Ars Technica site, according to which the project has been awarded to IBM and involves a contract of USD 3.45 million.
The company will use a crystallized substrate that breaks “when a fuse or reactive metallic layer” that contains it receives an external signal of radio frequencies.
This self-destruct instruction would make it possible to disintegrate lost or abandoned electronic devices on a battlefield over a large surface area, avoiding scenarios such as the “involuntary transfer of technology” that took place when a US helicopter had to be abandoned by the Marine SEAL team. that attacked the compound where Osama bin Laden was hiding in Pakistan in May 2011.
via IBM develops chip that self-destructs | diarioti.
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